SGA provides specialized flexible packaging solutions for wafer products, designed to preserve crispness, freshness, flavor, and structural integrity throughout the product's shelf life. Wafer products consist of multiple thin baked layers combined with cream, chocolate, or flavored fillings, making them highly sensitive to moisture absorption, oxygen exposure, and mechanical damage. Our advanced packaging structures are engineered to maintain the wafer's characteristic crunchy texture while protecting fillings and coatings from quality deterioration.
By combining high-barrier laminates with premium rotogravure printing, SGA packaging ensures superior product protection, efficient machine performance, and exceptional shelf appeal for both local and export markets.
Technical & Engineering Features
- High moisture barrier to maintain crispness and prevent texture degradation.
- Effective oxygen barrier to protect fillings and reduce fat oxidation.
- Excellent aroma retention and protection from external odors.
- High grease resistance for cream-filled and chocolate-coated wafers.
- Strong seal integrity to maintain package protection throughout transportation and storage.
- Good puncture and tear resistance to minimize product breakage.
- Optimized machinability on high-speed horizontal and vertical packaging lines.
- Food-grade materials and inks compliant with food packaging standards.
- High-definition rotogravure printing with premium visual effects and finishes.
Typical Packaging Structures
- BOPP / CPP
- BOPP / MCPP
- BOPP / MOPP
- PET / PE
- PET / MET PET / PE
- PET / ALU / PE
